US Patent 8080884 Mounting structure and mounting method
Patent 8080884 was granted and assigned to Panasonic on December, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A mounting structure of the present invention includes a semiconductor element 101, a circuit board 301 having electrodes 302 opposed to electrodes 102 of the semiconductor element 101, and conductive two-layer bumps 213. Second bumps 210 joined to the electrodes 302 of the circuit board 301 are formed larger than first bumps 209 joined to the electrodes 102 of the semiconductor element 101. The axis of the first bump 209 and the axis of the second bump 210 are not aligned with each other.
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Patent Inventor Names
Kentaro Kumazawa0
Kojiro Nakamura0
Yoshihiro Tomura0
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US Patent 08080884 Mounting structure and mounting method US Patent 8080884 Mounting structure and mounting method
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Patent Number
080808840
Patent Number
80808840
Edits on 27 Apr, 2023
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
080808840
Date of Patent
December 20, 2011
0Patent Application Number
124868410
Date Filed
June 18, 2009
0Patent Primary Examiner
Edits on 14 Dec, 2021
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US Patent 08080884 Mounting structure and mounting method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08080884
Date of patent
December 20, 2011
Patent application number
12486841
Date Filed
June 18, 2009
Patent primary examiner
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