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US Patent 8132465 Sensor element placement for package stress compensation

Patent 8132465 was granted and assigned to Silicon Microstructures, Inc. on March, 2012 by the United States Patent and Trademark Office.

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Patent abstract

Circuits, methods, and systems that calibrate or account for packaging and related stress components in a pressure sensor. Further examples provide an improved sensor element or device. One example provides one or more sensing elements on the diaphragm and near the diaphragm-bulk boundary. Sensors near the diaphragm-bulk are used to estimate package-induced stress. This estimation can then be used in calibrating package stress from pressure measurements.

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