US Patent 8132465 Sensor element placement for package stress compensation
Patent 8132465 was granted and assigned to Silicon Microstructures, Inc. on March, 2012 by the United States Patent and Trademark Office.
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Patent abstract
Circuits, methods, and systems that calibrate or account for packaging and related stress components in a pressure sensor. Further examples provide an improved sensor element or device. One example provides one or more sensing elements on the diaphragm and near the diaphragm-bulk boundary. Sensors near the diaphragm-bulk are used to estimate package-induced stress. This estimation can then be used in calibrating package stress from pressure measurements.
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Patent Inventor Names
Joachim Bergmann0
Michael B. Doelle0
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Patent Citations Received
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US Patent 08132465 Sensor element placement for package stress compensation US Patent 8132465 Sensor element placement for package stress compensation
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Patent Number
081324650
Patent Number
81324650
Edits on 27 Sep, 2022
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
081324650
Date of Patent
March 13, 2012
0Patent Application Number
121841590
Date Filed
July 31, 2008
0Patent Primary Examiner
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US Patent 08132465 Sensor element placement for package stress compensation
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08132465
Date of patent
March 13, 2012
Patent application number
12184159
Date Filed
July 31, 2008
Patent primary examiner
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