Patent 8139340 was granted and assigned to Plasma-Therm on March, 2012 by the United States Patent and Trademark Office.
The present invention provides an improved electrostatic chuck for a substrate processing system. The electrostatic chuck comprising a main body having a top surface configured to support the substrate, a power supply to apply a voltage to the main body and a sealing ring disposed between the main body and the substrate wherein the sealing ring has a conductive layer.