US Patent 8189361 Multi-chip assembly with optically coupled die
Patent 8189361 was granted and assigned to Intel on May, 2012 by the United States Patent and Trademark Office.
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Patent abstract
Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.
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US Patent 08189361 Multi-chip assembly with optically coupled die US Patent 8189361 Multi-chip assembly with optically coupled die
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Patent Number
0818936100
Patent Number
818936100
Edits on 1 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
081893610
Date of Patent
May 29, 2012
0Patent Application Number
129386080
Date Filed
November 3, 2010
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
081893610
Date of Patent
May 29, 2012
0Patent Application Number
129386080
Date Filed
November 3, 2010
0Patent Primary Examiner
Edits on 14 Dec, 2021
Golden AI
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US Patent 08189361 Multi-chip assembly with optically coupled die
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08189361
Date of patent
May 29, 2012
Patent application number
12938608
Date Filed
November 3, 2010
Patent primary examiner
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