US Patent 8189361 Multi-chip assembly with optically coupled die
Patent 8189361 was granted and assigned to Intel on May, 2012 by the United States Patent and Trademark Office.
Name
# Contributions
Last Contribution
Find more entities like US Patent 8189361 Multi-chip assembly with optically coupled die
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
