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US Patent 8199518 Top feature package and method
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Patent
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Date Filed
February 18, 2010
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Date of Patent
June 12, 2012
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Patent Application Number
12708033
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Patent Citations Received
US Patent 12003025 Selectively shielded radio frequency modules
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US Patent 11682649 Radio frequency modules
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US Patent 11757170 Semiconductor device and package
US Patent 11756902 High-frequency module
US Patent 11864295 Selectively shielded radio frequency module with multi-mode stacked power amplifier stage
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US Patent 11870402 Impedance transformation circuit for amplifier
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US Patent 11935840 Semiconductor device with partial EMI shielding removal using laser ablation
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US Patent 11984857 Impedance transformation circuit for amplifier
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Patent Inventor Names
Jong Ok Chun
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Richard Chen
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Giuseppe Selli
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Michael Kelly
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Nozad Karim
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
8199518
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Patent Primary Examiner
Jeremy Norris
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