Methods of forming titanium-containing films by atomic layer deposition are provided. The methods comprise delivering at least one precursor to a substrate, wherein the at least one precursor corresponds in structure to Formula I:

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Patent Inventor Names

Andrew Kingsley0

Fuquan Song0

Hywel Owen Davies0

Paul Williams0

Peter Nicholas Heys0

Rajesh Odedra0

Thomas Leese0

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US Patent 08221852 Methods of atomic layer deposition using titanium-based precursors US Patent 8221852 Methods of atomic layer deposition using titanium-based precursors

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Patent Number

08221852

Patent Number

8221852

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created this topic on 14 Dec, 2021

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US Patent 08221852 Methods of atomic layer deposition using titanium-based precursors

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Is a

Patent

Patent jurisdiction

United States Patent and Trademark Office

Patent number

08221852

Date of patent

July 17, 2012

Patent application number

12207973

Date Filed

September 10, 2008

Patent primary examiner

‌

Kelly M Gambetta

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