Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shih Hsiung Lin0
Hsin-Jung Lo0
Mou-Shiung Lin0
Date of Patent
July 31, 2012
0Patent Application Number
111244930
Date Filed
May 5, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A bonding process includes the following process. A bump is formed on a first electric device. A patterned insulation layer is formed on a second electric device, wherein the patterned insulation layer has a thickness between 5 μm and 400 μm, and an opening is in the patterned insulation layer and exposes the second electric device. The bump is joined to the second electric device exposed by the opening in the patterned insulation layer.
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