US Patent 8232192 Process of bonding circuitry components
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Patent abstract
A bonding process includes the following process. A bump is formed on a first electric device. A patterned insulation layer is formed on a second electric device, wherein the patterned insulation layer has a thickness between 5 μm and 400 μm, and an opening is in the patterned insulation layer and exposes the second electric device. The bump is joined to the second electric device exposed by the opening in the patterned insulation layer.
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Patent Inventor Names
Hsin-Jung Lo0
Mou-Shiung Lin0
Shih Hsiung Lin0
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US Patent 08232192 Process of bonding circuitry components US Patent 8232192 Process of bonding circuitry components
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Patent Number
082321920
Patent Number
82321920
Edits on 27 Mar, 2023
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Infobox
Is a
Patent Jurisdiction
Patent Number
082321920
Date of Patent
July 31, 2012
0Patent Application Number
111244930
Date Filed
May 5, 2005
0Patent Primary Examiner
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US Patent 08232192 Process of bonding circuitry components
Infobox
Is a
Patent jurisdiction
Patent number
08232192
Date of patent
July 31, 2012
Patent application number
11124493
Date Filed
May 5, 2005
Patent primary examiner
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