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US Patent 8238101 Heat transfer system for memory modules

Patent 8238101 was granted and assigned to Qimonda on August, 2012 by the United States Patent and Trademark Office.

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Patent abstract

The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

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