US Patent 8238101 Heat transfer system for memory modules
Patent 8238101 was granted and assigned to Qimonda on August, 2012 by the United States Patent and Trademark Office.
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Patent abstract
The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
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Patent Inventor Names
Christian Weiss0
Sven Kalms0
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US Patent 08238101 Heat transfer system for memory modules US Patent 8238101 Heat transfer system for memory modules
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Patent Number
08238101
Patent Number
8238101
Edits on 15 Dec, 2021
Golden AI
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US Patent 08238101 Heat transfer system for memory modules
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Is a
Current assignee
Patent jurisdiction
Patent number
08238101
Date of patent
August 7, 2012
Patent application number
12201524
Date Filed
August 29, 2008
Patent primary examiner
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