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US Patent 8338957 Low resistance through-wafer via

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Patent Citations Received
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US Patent 12131985 Hermetic metallized via with improved reliability
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US Patent 12080637 Through-hole electrode substrate
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US Patent 12009225 Electrically conductive vias and methods for producing same
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US Patent 11774233 Method and system for measuring geometric parameters of through holes
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Patent Inventor Names
Peter Nilsson0
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US Patent 08338957 Low resistance through-wafer via US Patent 8338957 Low resistance through-wafer via

Infobox
Patent Number
083389570
Patent Number
83389570
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
083389570
Date of Patent
December 25, 2012
0
Patent Application Number
124524680
Date Filed
June 27, 2008
0
Patent Primary Examiner
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Hoa B Trinh
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created this topic on 15 Dec, 2021
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 US Patent 08338957 Low resistance through-wafer via

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
08338957
Date of patent
December 25, 2012
Patent application number
12452468
Date Filed
June 27, 2008
Patent primary examiner
‌
Hoa B Trinh

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