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US Patent 8338957 Low resistance through-wafer via

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 27, 2008
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Date of Patent
December 25, 2012
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Patent Application Number
12452468
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Patent Citations Received
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US Patent 12131985 Hermetic metallized via with improved reliability
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US Patent 11774233 Method and system for measuring geometric parameters of through holes
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US Patent 11972993 Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
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US Patent 12009225 Electrically conductive vias and methods for producing same
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US Patent 12080637 Through-hole electrode substrate
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US Patent 11760682 Glass or glass ceramic articles with copper-metallized through holes and processes for making the same
Patent Inventor Names
Peter Nilsson
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8338957
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Patent Primary Examiner
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Hoa B Trinh
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