Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsin-Jung Lo0
Mou-Shiung Lin0
Shih-Hsiung Lin0
Date of Patent
February 5, 2013
0Patent Application Number
132365070
Date Filed
September 19, 2011
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.
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