US Patent 8368193 Chip package
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Edits on 29 Nov, 2023
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Patent abstract
A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.
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Patent Inventor Names
Hsin-Jung Lo0
Mou-Shiung Lin0
Shih-Hsiung Lin0
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US Patent 08368193 Chip package US Patent 8368193 Chip package
Infobox
Patent Number
083681930
Patent Number
83681930
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
083681930
Date of Patent
February 5, 2013
0Patent Application Number
132365070
Date Filed
September 19, 2011
0Patent Primary Examiner
Edits on 15 Dec, 2021
Golden AI
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Infobox (+7 properties)
US Patent 08368193 Chip package
Infobox
Is a
Patent jurisdiction
Patent number
08368193
Date of patent
February 5, 2013
Patent application number
13236507
Date Filed
September 19, 2011
Patent primary examiner
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