Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Brent M. Roberts0
Mihir K. Roy0
Sriram Srinivasan0
Date of Patent
March 5, 2013
Patent Application Number
12655588
Date Filed
December 31, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.
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