US Patent 8389337 Patch on interposer assembly and structures formed thereby
Patent 8389337 was granted and assigned to Intel on March, 2013 by the United States Patent and Trademark Office.
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Patent abstract
Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.
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Patent Inventor Names
Brent M. Roberts0
Mihir K. Roy0
Sriram Srinivasan0
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US Patent 08389337 Patch on interposer assembly and structures formed thereby US Patent 8389337 Patch on interposer assembly and structures formed thereby
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Patent Number
08389337
Patent Number
8389337
Edits on 16 Dec, 2021
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US Patent 08389337 Patch on interposer assembly and structures formed thereby
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Is a
Current assignee
Patent jurisdiction
Patent number
08389337
Date of patent
March 5, 2013
Patent application number
12655588
Date Filed
December 31, 2009
Patent primary examiner
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