Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jing-Cheng Lin0
Chen-Hua Yu0
Date of Patent
April 2, 2013
0Patent Application Number
128349430
Date Filed
July 13, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion bonding. The glass substrate includes a second TSV therein and electrically coupled to the first TSV.
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