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US Patent 8411459 Interposer-on-glass package structures

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Patent Citations Received
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US Patent 12131985 Hermetic metallized via with improved reliability
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US Patent 12009225 Electrically conductive vias and methods for producing same
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Patent abstract

A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion bonding. The glass substrate includes a second TSV therein and electrically coupled to the first TSV.

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US Patent 11774233 Method and system for measuring geometric parameters of through holes
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Patent Inventor Names
Chen-Hua Yu0
Jing-Cheng Lin0
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US Patent 08411459 Interposer-on-glass package structures US Patent 8411459 Interposer-on-glass package structures

Infobox
Patent Number
084114590
Patent Number
84114590
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
084114590
Date of Patent
April 2, 2013
0
Patent Application Number
128349430
Date Filed
July 13, 2010
0
Patent Primary Examiner
‌
Boris Chervinsky
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 US Patent 08411459 Interposer-on-glass package structures

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
08411459
Date of patent
April 2, 2013
Patent application number
12834943
Date Filed
July 13, 2010
Patent primary examiner
‌
Boris Chervinsky

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