Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hao Liu0
Ravi Kanth Kolan0
Chin Hock Toh0
Date of Patent
April 23, 2013
Patent Application Number
13400578
Date Filed
February 21, 2012
Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.
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