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US Patent 8426246 Vented die and package

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US Patent 12087679 Package core assembly and fabrication methods

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US Patent 11931855 Planarization methods for packaging substrates

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US Patent 11927885 Fluoropolymer stamp fabrication method

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US Patent 11887934 Package structure and fabrication methods

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US Patent 11881447 Package core assembly and fabrication methods

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US Patent 11862546 Package core assembly and fabrication methods

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US Patent 11837680 Substrate structuring methods

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Patent abstract

A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.

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Patent Inventor Names

Chin Hock Toh0

Hao Liu0

Ravi Kanth Kolan0

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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

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US Patent 11705365 Methods of micro-via formation for advanced packaging

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US Patent 11676832 Laser ablation system for package fabrication

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US Patent 08426246 Vented die and package US Patent 8426246 Vented die and package

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Patent Number

08426246

Patent Number

8426246

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created this topic on 16 Dec, 2021

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US Patent 08426246 Vented die and package

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Is a

Patent jurisdiction

United States Patent and Trademark Office

Patent number

08426246

Date of patent

April 23, 2013

Patent application number

13400578

Date Filed

February 21, 2012

Patent primary examiner

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