US Patent 8435421 Metal-passivating CMP compositions and methods
Patent 8435421 was granted and assigned to Cabot Microelectronics (company) on May, 2013 by the United States Patent and Trademark Office.
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Patent abstract
The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
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US Patent 08435421 Metal-passivating CMP compositions and methods US Patent 8435421 Metal-passivating CMP compositions and methods
Infobox
Patent Number
0843542100
Patent Number
843542100
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
084354210
Date of Patent
May 7, 2013
0Patent Application Number
130041130
Date Filed
January 11, 2011
0Patent Primary Examiner
Edits on 27 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
084354210
Date of Patent
May 7, 2013
0Patent Application Number
130041130
Date Filed
January 11, 2011
0Patent Primary Examiner
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US Patent 08435421 Metal-passivating CMP compositions and methods
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08435421
Date of patent
May 7, 2013
Patent application number
13004113
Date Filed
January 11, 2011
Patent primary examiner
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