US Patent 8445927 Light emitting diode package and manufacturing method thereof
Patent 8445927 was granted and assigned to Samsung on May, 2013 by the United States Patent and Trademark Office.
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Patent abstract
The present invention relates to a light emitting diode package and a manufacturing method thereof.
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Patent Citations Received
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Patent Inventor Names
Chang Hoon Kwak0
Il Woo Park0
Na Na Park0
Seong Ah Joo0
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US Patent 08445927 Light emitting diode package and manufacturing method thereof US Patent 8445927 Light emitting diode package and manufacturing method thereof
Infobox
Patent Number
084459270
Patent Number
84459270
Edits on 26 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
084459270
Date of Patent
May 21, 2013
0Patent Application Number
123602500
Date Filed
January 27, 2009
0Patent Primary Examiner
Edits on 16 Dec, 2021
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Infobox (+8 properties)
US Patent 08445927 Light emitting diode package and manufacturing method thereof
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08445927
Date of patent
May 21, 2013
Patent application number
12360250
Date Filed
January 27, 2009
Patent primary examiner
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