Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wen-Chih Chiou0
Weng-Jin Wu0
Chen-Hua Yu0
Jung-Chih Hu0
Date of Patent
July 16, 2013
0Patent Application Number
120440080
Date Filed
March 7, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A through via process is performed on a semiconductor substrate with a contact plug formed in an interlayer dielectric (ILD), and then a via plug is formed in the ILD layer to extend through a portion of the semiconductor substrate, followed forming an interconnection structure electrically connected with the contact plug and the via plug.
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