Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 16, 2013
Patent Application Number
12631346
Date Filed
December 4, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
A system and method for making semiconductor die connections with through-silicon vias (TSVs) are disclosed. A semiconductor die is manufactured with both via-first TSVs as well as via-last TSVs in order to establish low resistance paths for die connections between adjacent dies as well as for providing a low resistance path for feedthrough channels between multiple dies.
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