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US Patent 8487444 Three-dimensional system-in-package architecture

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Patent Citations Received
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US Patent 12001772 Ultra-short-height standard cell architecture
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Patent abstract

A system and method for making semiconductor die connections with through-silicon vias (TSVs) are disclosed. A semiconductor die is manufactured with both via-first TSVs as well as via-last TSVs in order to establish low resistance paths for die connections between adjacent dies as well as for providing a low resistance path for feedthrough channels between multiple dies.

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US Patent 11804419 Semiconductor device
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US Patent 11770982 Microwave integrated quantum circuits with cap wafers and their methods of manufacture
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US Patent 11749586 Semiconductor device including through via structure
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US Patent 08487444 Three-dimensional system-in-package architecture US Patent 8487444 Three-dimensional system-in-package architecture

Infobox
Patent Number
0848744400
Patent Number
848744400
Edits on 25 Apr, 2023
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edited on 25 Apr, 2023
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
084874440
Date of Patent
July 16, 2013
0
Patent Application Number
126313460
Date Filed
December 4, 2009
0
Patent Primary Examiner
‌
Tammy Thanh Nguyen
0
Edits on 27 Sep, 2022
"Entity importer update"
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Golden AI
edited on 27 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
084874440
Date of Patent
July 16, 2013
0
Patent Application Number
126313460
Date Filed
December 4, 2009
0
Patent Primary Examiner
‌
Tammy Thanh Nguyen
0
Edits on 17 Dec, 2021
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created this topic on 17 Dec, 2021
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 US Patent 08487444 Three-dimensional system-in-package architecture

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
08487444
Date of patent
July 16, 2013
Patent application number
12631346
Date Filed
December 4, 2009
Patent primary examiner
‌
Tammy Thanh Nguyen

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