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US Patent 8503186 System-in packages

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
July 22, 2010
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Date of Patent
August 6, 2013
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Patent Application Number
12841981
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Patent Citations Received
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US Patent 12129168 Microelectronics package with vertically stacked MEMS device and controller device
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US Patent 12112999 RF devices with enhanced performance and methods of forming the same
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US Patent 12125739 RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
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US Patent 12125825 RF devices with enhanced performance and methods of forming the same
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US Patent 11664241 RF devices with enhanced performance and methods of forming the same
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US Patent 11664269 RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
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US Patent 11676878 Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
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US Patent 11705362 RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
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US Patent 11705428 RF devices with enhanced performance and methods of forming the same
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US Patent 11710704 RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8503186
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Patent Primary Examiner
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Matthew W Such
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