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US Patent 8519514 Semiconductor device and manufacturing method thereof
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Edits on 9 Oct, 2024
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Golden AI
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Patent Citations Received
US Patent 12113056 Stacked dies and methods for forming bonded structures
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Edits on 10 Apr, 2024
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edited on 10 Apr, 2024
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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Edits on 21 Mar, 2024
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Golden AI
edited on 21 Mar, 2024
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US Patent 11935907 Image sensor device
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Edits on 20 Sep, 2023
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Golden AI
edited on 20 Sep, 2023
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US Patent 11764177 Bonded structure with interconnect structure
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edited on 20 May, 2023
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US Patent 08519514 Semiconductor device and manufacturing method thereof
US Patent 8519514 Semiconductor device and manufacturing method thereof
Infobox
Patent Number
08519514
Patent Number
8519514
Edits on 17 Dec, 2021
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Golden AI
created this topic on 17 Dec, 2021
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US Patent 08519514 Semiconductor device and manufacturing method thereof
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Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
08519514
Date of patent
August 27, 2013
Patent application number
12923713
Date Filed
October 5, 2010
Patent primary examiner
Jasmine Clark
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