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US Patent 8558372 Semiconductor device
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Edits on 29 May, 2024
"update inverses"
Golden AI
edited on 29 May, 2024
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Patent Citations Received
US Patent 11996343 Thermal routing trench by additive processing
1
1
Type:
Web page
Patent.
https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11996343
Edits on 4 Apr, 2024
"update inverses"
Golden AI
edited on 4 Apr, 2024
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Patent Citations Received
US Patent 11948855 Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
1
1
Type:
Web page
Patent.
https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11948855
Edits on 27 Sep, 2023
"update inverses"
Golden AI
edited on 27 Sep, 2023
Edits made to:
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+1
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Patent Citations Received
US Patent 11769710 Heterogeneous integration module comprising thermal management apparatus
Edits on 14 Jun, 2023
"update inverses"
Golden AI
edited on 14 Jun, 2023
Edits made to:
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+1
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Patent Citations Received
US Patent 11676880 High thermal conductivity vias by additive processing
1
1
Type:
Web page
Patent.
https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11676880
Edits on 23 May, 2023
"Remove leading 0 from patent number"
Golden AI
edited on 23 May, 2023
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US Patent 08558372 Semiconductor device
US Patent 8558372 Semiconductor device
Infobox
Patent Number
08558372
Patent Number
8558372
Edits on 18 Dec, 2021
"Created via: Entity Importer"
Golden AI
created this topic on 18 Dec, 2021
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US Patent 08558372 Semiconductor device
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
08558372
Date of patent
October 15, 2013
Patent application number
13584022
Date Filed
August 13, 2012
Patent primary examiner
S. V. Clark
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