Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 8, 2014
Patent Application Number
13536268
Date Filed
June 28, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device.
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