US Patent 8692388 Integrated circuit package system with waferscale spacer
All edits
Edits on 20 Jun, 2024
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 1 Dec, 2023
Golden AI
Edits made to:
Article (+293 characters)
Article
Patent abstract
An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device.
Edits on 22 Jul, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 08692388 Integrated circuit package system with waferscale spacer US Patent 8692388 Integrated circuit package system with waferscale spacer
Infobox
Patent Number
0869238800
Patent Number
869238800
Edits on 26 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
086923880
Date of Patent
April 8, 2014
0Patent Application Number
135362680
Date Filed
June 28, 2012
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
086923880
Date of Patent
April 8, 2014
0Patent Application Number
135362680
Date Filed
June 28, 2012
0Official Website
Patent Primary Examiner
Edits on 19 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 22 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 08692388 Integrated circuit package system with waferscale spacer
Infobox
Is a
Patent jurisdiction
Patent number
08692388
Date of patent
April 8, 2014
Patent application number
13536268
Date Filed
June 28, 2012
Patent primary examiner
Find more entities like US Patent 8692388 Integrated circuit package system with waferscale spacer
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
