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US Patent 8703542 Wafer-level packaging mechanisms

Patent 8703542 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2014 by the United States Patent and Trademark Office.

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Edits on 30 Oct, 2024
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edited on 30 Oct, 2024
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US Patent 12132004 Semiconductor devices and methods of manufacture
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edited on 30 Oct, 2024
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US Patent 12131984 Heterogeneous fan-out structure and method of manufacture
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edited on 24 Oct, 2024
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US Patent 12125820 Through-dielectric vias for direct connection and method forming same
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edited on 24 Oct, 2024
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US Patent 12125797 Package structure with fan-out feature
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Edits on 16 Oct, 2024
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edited on 16 Oct, 2024
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US Patent 12119320 Chip package structure with bump
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edited on 16 Oct, 2024
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edited on 9 Oct, 2024
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US Patent 12113025 Semiconductor package with dual sides of metal routing
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edited on 9 Oct, 2024
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US Patent 12113005 Packages with Si-substrate-free interposer and method forming same
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edited on 19 Sep, 2024
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US Patent 12094828 Eccentric via structures for stress reduction
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edited on 19 Sep, 2024
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US Patent 12094810 Reinforcing package using reinforcing patches
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edited on 19 Sep, 2024
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US Patent 12094765 Integrated circuit package and method
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Edits on 4 Sep, 2024
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edited on 4 Sep, 2024
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US Patent 12080653 Formation method of chip package with fan-out structure
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edited on 4 Sep, 2024
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US Patent 12080623 Integrated circuit packages having mechanical brace standoffs
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Edits on 26 Jun, 2024
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edited on 26 Jun, 2024
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US Patent 12021037 Method for manufacturing package structure
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Edits on 20 Jun, 2024
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edited on 20 Jun, 2024
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US Patent 12014979 Methods of forming semiconductor packages
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Edits on 5 Jun, 2024
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edited on 5 Jun, 2024
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US Patent 12002767 Integrated circuit package and method
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Edits on 22 May, 2024
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edited on 22 May, 2024
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US Patent 11990381 Integrated circuit packages having support rings
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Edits on 15 May, 2024
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edited on 15 May, 2024
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US Patent 11984410 Air channel formation in packaging process
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edited on 15 May, 2024
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US Patent 11984375 Integrated circuit package and method
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Edits on 4 Apr, 2024
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Golden AI
edited on 4 Apr, 2024
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US Patent 11948930 Semiconductor package and method of manufacturing the same
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