US Patent 8716765 Contact structure of semiconductor device
Patent 8716765 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2014 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 23, 2012
Date of Patent
May 6, 2014
Patent Application Number
13428972
Patent Citations Received
•••
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 8716765 Contact structure of semiconductor device
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
