US Patent 8791549 Wafer backside interconnect structure connected to TSVs

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

87915490

Patent Inventor Names

Shau-Lin Shue0

Wen-Chih Chiou0

Ming-Fa Chen0

Date of Patent

July 29, 2014

Patent Application Number

128320190

Date Filed

July 7, 2010

Patent Citations Received

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US Patent 12119318 Bonding structure and method of forming same

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US Patent 11664336 Bonding structure and method of forming same

‌

US Patent 11843020 Image sensor

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US Patent 12080628 Micro through-silicon via for transistor density scaling

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US Patent 12112997 Micro through-silicon via for transistor density scaling

Patent Primary Examiner

‌

Hoang-Quan Ho

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