US Patent 8791549 Wafer backside interconnect structure connected to TSVs
Is a
Date Filed
July 7, 2010
0
Date of Patent
July 29, 2014
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Patent Application Number
12832019
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Patent Citations Received
Patent Inventor Names
Shau-Lin Shue
0
Wen-Chih Chiou
0
Ming-Fa Chen
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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