US Patent 8794250 Substrate processing method and substrate processing apparatus
Patent 8794250 was granted and assigned to Tokyo Electron on August, 2014 by the United States Patent and Trademark Office.
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Patent Inventor Names
Hiroki Ohno0
Kenji Sekiguchi0
Noritaka Uchida0
Satoru Tanaka0
Takehiko Orii0
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US Patent 08794250 Substrate processing method and substrate processing apparatus US Patent 8794250 Substrate processing method and substrate processing apparatus
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Patent Number
08794250
Patent Number
8794250
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US Patent 08794250 Substrate processing method and substrate processing apparatus
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
08794250
Date of patent
August 5, 2014
Patent application number
13693712
Date Filed
December 4, 2012
Patent primary examiner
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