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US Patent 8841777 Bonded structure employing metal semiconductor alloy bonding

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Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Zhengwen Li0

Zhijiong Luo0

Huilong Zhu0

Mukta G. Farooq0

Date of Patent

September 23, 2014

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Patent Application Number

126859540

Date Filed

January 12, 2010

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Patent Citations Received

US Patent 12136562 3D semiconductor device and structure with single-crystal layers

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US Patent 12068187 3D semiconductor device and structure with bonding and DRAM memory cells

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US Patent 12080743 Multilevel semiconductor device and structure with image sensors and wafer bonding

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US Patent 12094892 3D micro display device and structure

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US Patent 12094965 3D semiconductor device and structure with metal layers and memory cells

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US Patent 12119318 Bonding structure and method of forming same

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US Patent 12120880 3D semiconductor device and structure with logic and memory

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US Patent 12125737 3D semiconductor device and structure with metal layers and memory cells

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