US Patent 8853853 Bump structures

Patent 8853853 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2014 by the United States Patent and Trademark Office.

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Patent

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Current Assignee

Taiwan Semiconductor Manufacturing Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

88538530

Patent Inventor Names

Tin-Hao Kuo0

Chen-Shien Chen0

Chih-Horng Chang0

Yen-Liang Lin0

Date of Patent

October 7, 2014

Patent Application Number

131923020

Date Filed

July 27, 2011

Patent Citations Received

‌

US Patent 12087662 Semiconductor package structure having thermal management structure

‌

US Patent 12021014 Bump joint structure with distortion and method forming same

Patent Primary Examiner

‌

Marvin Payen

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