US Patent 8853853 Bump structures
Patent 8853853 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2014 by the United States Patent and Trademark Office.
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Patent Inventor Names
Chen-Shien Chen0
Chih-Horng Chang0
Tin-Hao Kuo0
Yen-Liang Lin0
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US Patent 08853853 Bump structures US Patent 8853853 Bump structures
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Patent Number
088538530
Patent Number
88538530
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Official Website
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
088538530
Date of Patent
October 7, 2014
0Patent Application Number
131923020
Date Filed
July 27, 2011
0Official Website
Patent Primary Examiner
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US Patent 08853853 Bump structures
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08853853
Date of patent
October 7, 2014
Patent application number
13192302
Date Filed
July 27, 2011
Patent primary examiner
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