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US Patent 8860495 Method of forming electronic components with increased reliability

Patent 8860495 was granted and assigned to Transphorm Inc. on October, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

88604950

Patent Inventor Names

Nicholas Fichtenbaum0

Umesh Mishra0

Yifeng Wu0

Yuvaraj Dora0

Primit Parikh0

Rakesh K. Lal0

Robert Coffie0

Srabanti Chowdhury0

Date of Patent

October 14, 2014

Patent Application Number

140689440

Date Filed

October 31, 2013

Patent Citations Received

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US Patent 11973138 N-polar devices including a depleting layer with improved conductivity

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US Patent 12074150 Module configurations for integrated III-nitride devices

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US Patent 11749656 Module configurations for integrated III-Nitride devices

Patent Primary Examiner

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Kenneth B Wells

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