US Patent 8860495 Method of forming electronic components with increased reliability
Patent 8860495 was granted and assigned to Transphorm Inc. on October, 2014 by the United States Patent and Trademark Office.
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Patent Inventor Names
Nicholas Fichtenbaum0
Primit Parikh0
Rakesh K. Lal0
Robert Coffie0
Srabanti Chowdhury0
Umesh Mishra0
Yifeng Wu0
Yuvaraj Dora0
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US Patent 08860495 Method of forming electronic components with increased reliability US Patent 8860495 Method of forming electronic components with increased reliability
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Patent Number
088604950
Patent Number
88604950
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Official Website
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
088604950
Date of Patent
October 14, 2014
0Patent Application Number
140689440
Date Filed
October 31, 2013
0Official Website
Patent Primary Examiner
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US Patent 08860495 Method of forming electronic components with increased reliability
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
08860495
Date of patent
October 14, 2014
Patent application number
14068944
Date Filed
October 31, 2013
Patent primary examiner
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