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US Patent 8921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing

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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11931855 Planarization methods for packaging substrates
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US Patent 11927885 Fluoropolymer stamp fabrication method
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US Patent 11887934 Package structure and fabrication methods
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11862546 Package core assembly and fabrication methods
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Patent Inventor Names
Steven D. Cate0
Tarak A. Railkar0
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US Patent 11705365 Methods of micro-via formation for advanced packaging
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US Patent 11676832 Laser ablation system for package fabrication
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=089219950
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US Patent 08921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing US Patent 8921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing

Infobox
Patent Number
089219950
Patent Number
89219950
Edits on 31 Mar, 2023
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
089219950
Date of Patent
December 30, 2014
0
Patent Application Number
131836910
Date Filed
July 15, 2011
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=089219950
Patent Primary Examiner
‌
Chris Chu
0
Edits on 15 Jun, 2022
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edited on 15 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=08921995
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 US Patent 08921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
08921995
Date of patent
December 30, 2014
Patent application number
13183691
Date Filed
July 15, 2011
Patent primary examiner
‌
Chris Chu

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