Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 13, 2015
Patent Application Number
13562184
Date Filed
July 30, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
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