US Patent 8969176 Laminated transferable interconnect for microelectronic package
Patent 8969176 was granted and assigned to Raytheon on March, 2015 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 3, 2010
Date of Patent
March 3, 2015
Patent Application Number
12959549
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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