Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsu-Hsien Chen0
Chen-Shien Chen0
Chih-Hua Chen0
En-Hsiang Yeh0
Monsen Liu0
Date of Patent
March 10, 2015
Patent Application Number
13649941
Date Filed
October 11, 2012
Patent Citations Received
0
0
...
Patent Primary Examiner
Patent abstract
A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.
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