Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Soojeoung Park0
Date of Patent
May 12, 2015
0Patent Application Number
139690530
Date Filed
August 16, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes a substrate, a ground circuit supported by the substrate, at least one semiconductor chip disposed on the substrate and a carbon-containing heat-dissipating part disposed on the substrate and electrically connected to the ground circuit. The heat-dissipating part may include carbon fibers and/or carbon cloth.
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