Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 13, 2023
0Patent Application Number
174615670
Date Filed
August 30, 2021
0Patent Citations
Patent Citations Received
Patent Primary Examiner
A package structure and a formation method of a package structure are provided. The package structure includes a circuit substrate and a die package bonded to the circuit substrate through bonding structures. The package structure also includes a warpage-control element attached to the circuit substrate. The warpage-control element has a protruding portion extending into the circuit substrate. The warpage-control element has height larger than that of the die package.
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