Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 21, 2015
0Patent Application Number
134712290
Date Filed
May 14, 2012
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An embodiment is a method for forming a microelectromechanical system (MEMS) device. The method comprises forming a MEMS structure over a first substrate, wherein the MEMS structures comprises a movable element; forming a bonding structure over the first substrate; and forming a support structure over the first substrate, wherein the support structure protrudes from the bonding structure. The method further comprises bonding the MEMS structure to a second substrate; and forming a through substrate via (TSV) on a backside of the second substrate, wherein the overlying TSV is aligned with the bonding structure and the support structure.
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