Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hung-Yi Kuo0
Hao-Yi Tsai0
Ming-Hung Tseng0
Tzu-Sung Huang0
Chen-Hua Yu0
Date of Patent
December 5, 2023
0Patent Application Number
176686480
Date Filed
February 10, 2022
0Patent Citations
...
Patent Primary Examiner
Patent abstract
A semiconductor device package is provided. The semiconductor device package includes a semiconductor device, a molding material surrounding the semiconductor device, and a conductive slot positioned over the molding material. The conductive slot has an opening and at least two channels connecting the opening to the edges of the conductive slot, and at least two of the channels extend in different directions.
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